The Via Rules dialog is used to specify if vias are allowed in pads.

Shortcuts

Menu: Setup

Default Keys: T

Command: Technology

Locating this option

Available from: Setup menu > Technology option > Rules - DFM/DFT - Via page

Using the Via Rules dialog

On selection, the Technology dialog opens, select Via Rules. The existing Via Rules for the Technology being used will be presented.

The buttons to the right side of the dialog are used to navigate the grid, the general common buttons are detailed on the Technology Navigation page.

Using the editing pane

The appropriate via rule is found for each net or pad by working down the list of rules until the first match is found. Hence, the order of the rules is important. A match is when the specified Attribute Name and Match Value match attributes of a net or pad. So the pad (or net) must have the given attribute, and it’s value must wildcard match the value.

You must also specify if the rule applies to electrical layers, or just the Top, Bottom, all Inner or both Outer (Top & Bottom) electrical layers. Alternatively, you can specify a specific layer name, or a wildcard matching string. (So ‘ground *’ would match layers ‘ground 1’ and ‘ground 2’). The Wildcard Wizard is enabled using the small icon next to the Match Value entry:

If you have any Areas defined in the design, a rule can be defined for a specific named area. Rules can be defined for any combination of Layers and Areas, as required. Similarly, a wildcard string can be defined to match areas. The matching areas must be marked as a Style Override Area and must have a name so they can be identified.

The Normal Via in Surface Mount Pad rule defines if Vias are allowed in Surface Mount Pads, also called Via In Pads (VIPs), this is used by the Via In Pad check. You can control normal vias and micro-vias separately by checking or unchecking the Micro-Via in Surface Mount Pad option.

This rule is also used if you are creating VIPPPOs (Via In Pad Plated Over) for small pitch BGAs where there is not enough space to track out of the BGA pad and drop a via to reach the other layers. The via used within the BGA pad would be filled so that the BGA pad still has a solid surface to solder to.

The Same Net Via To SMD Pad Min Spacing rule defines the minimum required distance between Vias and SMD Pads on the same net. This is used by the Same Net Via To SMD check, and can be enabled for Online DRC in Options - Online DRC. Use Check Micro-Via to Surface Mount Pad to include Micro-Vias in this spacing check.

Export and Import CSV

Use the Export CSV button to export the data in your PCB design into a CSV format file. Using the Export CSV option will provide you with a formatted template ready for you to edit in your own data.

Use the Import CSV button to import data back into the PCB design using a CSV format file.

The data in the file represents a spreadsheet of dialog contents with the data headings along the top row.

Units

The Units button allows you to locally switch between Metric and Imperial units whilst in this dialog. Once the dialog is closed, the units revert back to the original design units. If switching to different units to the design units, the value typed will be converted when you next enter this page.

Technology Overview | Using Dialog Grids | Design Rule Check | Export CSV | Import CSV