This tab allows you to set the default properties for Die Pad used when added to your footprint.
This feature is available with the Chip On Board option.
Shortcuts
Default Keys: Shift+D
Default Menu: Setup
Command: Design Settings
Locating this option
Available from:
Setup menu > Design Settings option > Defaults > Die Pad page
Setup menu > Technology option > Design Settings > Defaults > Die Pad page
Using the Die Pad Defaults Tab
When adding a Die Pad to your footprint you will need an electrical Layer and Pad Style.
The Die Pad will also be associated with a Bond Pad added using the Bond Pad option as well as a Wire Layer and Wire Style. See Bond Pad Defaults for more information.
Layer
The Layer that the Die Pad resides on is selected from a drop down list defined in the Technology Layers dialog. This will be an electrical layer available from the Layers dialog.
Pad Style
Choose a suitable Pad Style for the Die Pad from the drop down list defined in the Pad Style dialog.
Related Topics
Technology Overview | Layers | Pad Styles | Wire Layer | Wire Style | Insert Bond Pad | Insert Die Pad | Properties